2012年智能结构与振动控制国际学术研讨会
（ISVC 2012）
凡同一第一作者注册2篇者，优先考虑推荐1篇上EI源刊
2012年1月13日-15日, 中国·重庆
http://www.theiast.org/isvc2012
2012年智能结构与振动控制国际学术研讨会（ISVC2012）为瑞士TTP公司旗下的官方会议，将于1月13-15日在中国重庆举行（EnPapers 论文翻译、英文论文修改、SCI论文润色）。本次会议由浦项理工大学（Korea）、湖南工程学院、河南科技学院、重庆师范大学、重庆大学承办，由武汉理工大学等单位协办（EnPapers 论文翻译、英文论文修改、SCI论文润色）。本次会议旨在为智能结构与振动控制等领域内的科研工作者提供一个交流的平台，会议将邀请国内外知名学者做大会报告（EnPapers 论文翻译、英文论文修改、SCI论文润色）。
另外，ISVC2011 (http://www.theiast.org/isvc2011)已于重庆成功举办，并且ISVC2011所录用的论文已成功被EI 检索（EnPapers 论文翻译、英文论文修改、SCI论文润色）。
2012年智能结构与振动控制国际学术研讨会（ISVC2012）包括以下主题（但征稿不局限于下面所列主题）：
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l Advanced Intelligent Structure
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l Algorithms pertaining to data fusion of sensor network
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l Sensors for structural monitoring
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l Sensors and actuators for structural health monitoring data
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l Other Related Issues
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l Bio-inspired Smart Materials and Structures
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l Synthesis and Characterization of Bio-Inspired Materials
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l Modeling of Bio-Inspired Materials
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l Development and Characterization of Bio-Inspired Structures
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l Other Related Issues
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l Active Materials, Mechanics and Behavior
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l Micro- and nano-characterization of electromechanical properties
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l Multi-scale and statistical methods
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l Active materials in MEMS applications
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l Other Related Issues
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l Vibration and Control
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l Dynamics, Vibration and Time-dependent Deformation
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l Experimental Mechanics
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l Random Vibration and Control
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l Other Related Issues
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l Modeling, Simulation, Control and Applications
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l Wireless Communication Systems
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l Intelligent Control
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l Human-Computer Interaction
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l Other Related Issues
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本次会议只接受原创的、没有公开发表的论文，录用的文章将在TTP公司出版，所有论文由该公司旗下的EI检索的国际期刊Applied Mechanics and Materials (AMM) Journal (ISSN: 1660-9336)出版（EnPapers 论文翻译、英文论文修改、SCI论文润色）。优秀论文并将推荐到更高级别的SCI和EI源刊上发表，推荐数量大约100篇左右（EnPapers 论文翻译、英文论文修改、SCI论文润色）。其中以第一作者注册两篇优先推荐一篇论文到源刊上（EnPapers 论文翻译、英文论文修改、SCI论文润色）。
所有的论文要求为PDF格式，并以电子方式提交投稿系统，所有稿件要求为全英文稿件，论文的格式请到会议网站下载（EnPapers 论文翻译、英文论文修改、SCI论文润色）。其中要求所有文章不低于4页（EnPapers 论文翻译、英文论文修改、SCI论文润色）。
具体推荐源刊刊物如下：
l Elsevier Future Generation Computer Systems (SCI, EI)
l International Journal of High Performance Computing and Networking (EI)
l Journal of Multimedia (EI)
l Journal of Computers (EI)
l International Journal of Radio Frequency Identification Technology and Applications (EI)
l International Journal of Manufacturing Research (EI)
l International Journal of Radio Frequency Identification Technology and Applications (EI)
l International Journal of Materials and Product Technology (SCI, EI)
l Springer Telecommunication Systems Journal (SCI, EI)
重要日期:
截稿日期：2011年6月20日 录用日期：2011年6月30日
注册截止日期：2011年7月10日
论文投稿系统地址为：
https://www.easychair.org/account/signin.cgi?conf=isvc2012
欢迎大家踊跃投稿并参会交流！
2012 International Conference on Intelligent Structure and Vibration Control
（ISVC 2012）
January 13-15, 2012, Chongqing, China
http://www.theiast.org/isvc2012
2012 International Conference on Intelligent Structure and Vibration Control (ISVC 2012) will be held on January 13-15, 2012, in Chongqing, China, which is organized by IAST, Shanghai Jiao Tong University, Chongqing University, Chongqing Normal University, Nanyang Technological University, Henan Institute of Science and Technology, Hunan Institute of Engineering. This conference provides a forum for researchers and practitioners to exchange research results and share development experiences.
In addition, ISVC2011 (http://www.theiast.org/isvc2011) had been held in Chongqing successfully and the paper accepted by ISVC2011 had been indexed by EI successfully.
Upcoming ISVC 2012 proceedings covers, but not limited to the following areas:
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l Advanced Intelligent Structure
|
|
l Algorithms pertaining to data fusion of sensor network
|
l Sensors for structural monitoring
|
|
l Sensors and actuators for structural health monitoring data
|
l Other Related Issues
|
|
l Bio-inspired Smart Materials and Structures
|
|
l Synthesis and Characterization of Bio-Inspired Materials
|
l Modeling of Bio-Inspired Materials
|
|
l Development and Characterization of Bio-Inspired Structures
|
l Other Related Issues
|
|
l Active Materials, Mechanics and Behavior
|
|
l Micro- and nanocharacterization of electromechanical properties
|
l Multi-scale and statistical methods
|
|
l Active materials in MEMS applications
|
l Other Related Issues
|
|
l Vibration and Control
|
|
l Dynamics, Vibration and Time-dependent Deformation
|
l Experimental Mechanics
|
|
l Random Vibration and Control
|
l Other Related Issues
|
|
l Modeling, Simulation, Control and Applications
|
|
l Wireless Communication Systems
|
l Intelligent Control
|
|
l Human-Computer Interaction
|
l Other Related Issues
|
Publication
The accepted papers will be published by Trans Tech Publications (TTP) in Applied Mechanics and Materials (AMM) Journal (ISSN: 1660-9336), which should be indexed by EI according the previous TTP proceedings index results. 5-page length in total is allowed for each paper (paper less than 4 pages will be rejected directly). Up to one additional page will be permitted with additional fees. Papers must strictly follow the format available at the conference website. Papers must be submitted electronically as described at the conference website.
Selected about 100 papers will be published by several special issues in well-known international journals (SCI, EI).
l Elsevier Future Generation Computer Systems (SCI, EI)
l International Journal of High Performance Computing and Networking (EI)
l Journal of Multimedia (EI)
l Journal of Computers (EI)
l International Journal of Radio Frequency Identification Technology and Applications (EI)
l International Journal of Manufacturing Research (EI)
l International Journal of Radio Frequency Identification Technology and Applications (EI)
l International Journal of Materials and Product Technology (SCI, EI)
l Springer Telecommunication Systems Journal (SCI, EI)
Important Dates
Full manuscript submission: June 20, 2011
Acceptance notification: June 30, 2011
Final manuscript submission: July 10, 2011
Submission system:
https://www.easychair.org/account/signin.cgi?conf=isvc2012
