2011 International Conference on Mechatronics and Materials Processing
2011年机电一体化与材料加工国际会议(ICMMP 2011)
2011年11月18日—20日；中国广州
2011年机电一体化与材料加工国际会议(ICMMP2011) 将于2011年11月18日—20日在中国广州召开（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。会议内容涵盖了机电一体化与材料加工领域的主要研究方向，
会议旨在为全世界机电一体化与材料加工领域的专家、学者和专业技术人员提供一个交流最新研究成果的机会（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。
主题1 材料科学与技术
(01) 纳米材料
(02) 复合材料与高分子材料
(03) 生物材料
(04) 半导体与微电子材料
(05) 智能材料与智能系统
(06) 薄膜材料
(07) 新功能材料
(08) 金属合金材料
(09) 钢铁
(10) 建筑材料
(11) 材料成型
(12) 涂层与表面工程
(13) 材料特性
(14) 材料机械性能与断裂
(15) 材料试验与评价
主题2 制造技术与加工工艺
(16) 制造系统建模、分析与仿真
(17) 高速、精密加工技术
(18) CAD/CAM/ CAE
(19) 虚拟制造与并行工程
(20) 绿色设计与制造
(21) 数字制造与敏捷制造
(22) PDM、ERP及供应链管理与物流
(23) 仿生机械与生物制造
(24) 摩擦学
(25) 集成制造系统
(26) 激光加工技术
(27) 材料加工
(28) 微纳米加工技术与工艺
(29) 热工理论与应用
(30) 制造过程中的试验、测量、监测与控制
(31)工程优化
(32)产品设计与开发
(33) 项目管理与工程管理
主题3 机电一体化与自动化
(34) 机电一体化
(35) 工业机器人与自动化
(36) 智能控制、神经网络控制与糊模控制
(37) 工业自动化与过程控制
(38) 分布式控制系统
(39) 嵌入式系统
(40) 控制系统建模与仿真
(41) 企业信息化与信息处理技术
(42) 虚拟仪器
(43) 传感器与多传感器数据熔合技术
(44) 先进测量与机器视觉系统
(45) 流体传动与控制
(46) 动力学、振动与控制
主题4 工程教育与培训
(47) 工程教育与培训
主题5 其他相关主题
(48) 其他相关主题
二、征文要求
会议语言为英语，请务必用英语撰写论文（EnPapers 论文翻译、英文论文修改、SCI论文润色）。所投论文应在国内外未曾公开发表过，在理论或应用方面有创见（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。论文须严格按《
Advanced Materials Research》的要求撰写（格式模板文件见
会议网址：
http://www.icmmp.org）（EnPapers 论文翻译、英文论文修改、SCI论文润色）。投稿时请同时提交论文的MS Word版本及PDF版本（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。
论文全文提交方式：通过E-mail以邮件附件的形式将你的论文全文以及填写完毕的论文登记表提交给组委会（icmmpx@gmail.com）（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。
三、重要日期
论文全文提交截止日期: 2011年5月10日
论文录用通知日期: 2011年6月10日
修改论文提交与注册截止日期: 2011年7月1日
每篇录用论文必须注册方可发表（EnPapers 论文翻译、英文论文修改、SCI论文润色）。注册费为2600元人民币/篇或400美元/篇（EnPapers 论文翻译、英文论文修改、SCI论文润色）。如论文超过4页，每超1页需另加300元人民币或50美元（EnPapers 论文翻译、英文论文修改、SCI论文润色）。每篇录用论文至少一名作者注册，方可发表（EnPapers 论文翻译、英文论文修改、SCI论文润色）。以第一作者身份投多篇论文，从第二篇起论文注册费降为2300元（EnPapers 论文翻译、英文论文修改、SCI论文润色）。如果论文被推荐到SCI收录期刊上发表，则需要交纳额外的出版费（EnPapers 论文翻译、
英文论文修改、SCI论文润色）。
五、联系方式
电话: +86 20 3936 6470
电话: +86 15817065241
地址：广州市大学城外环西路230号广州大学机械与电气工程学院ICMMP2011组委会， 510006
2011 International Conference on Mechatronics and Materials Processing (ICMMP2011) will be held during November 18-20, 2011, in Guangzhou, China. ICMMP2011 aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Mechatronics and Materials Processing.
All accepted papers will be published in international journal "Advanced Materials Research" [ISSN:1022-6680, Trans Tech Publications] and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP), and other indexing services(See TTP"s Conference List). The full text is online available via platform www.scientific.net. Trans Tech Publications will provide online camera-ready paper submission system. About 100 selected excellent papers will be published in SCI-indexed journals Materials and Manufacturing Processes (Taylor & Francis) , Surface Engineering (Maney Publishing), Advanced Science Letters (American Scientific Publishers).
Topics of interest include, but are not limited to:
(I) Material Science and Technology
(01) Nanomaterials
(02) Composites and polymer materials
(03) Biomaterials
(04) Semi-conductor and micro-electronic materials
(05) Smart/Intelligent Materials/Intelligent Systems
(06) Thin Films
(07) New Functional Materials
(08) Metal alloy materials
(09) Iron and Steel
(10) Building Materials
(11) Materials forming
(12) Coatings and surface engineering
(13) Materials Characterization
(14) Mechanical Behavior & Fracture
(15) Testing and Evaluation of Materials
(II) Manufacturing Technology and Processing
(16) Modeling, analysis and simulation of manufacturing processes
(17) High-speed/precision machining
(18) CAD/CAM/ CAE
(19) Virtual manufacturing and concurrent engineering
(20) Green design and manufacturing
(21) Digital and agile manufacturing
(22) PDM, ERP, logistics and supply chain
(23) Bionic mechanisms and bio-manufacturing
(24) Tribology in Manufacturing Processes
(25) Integrated Manufacturing System
(26) Laser Processing Technology
(27) Materials Machining
(28) Micro- and nano-fabrication, materials processing and technology
(29) Thermal Engineering Theory and Applications
(30) Testing, measuring, monitoring and controlling of manufacturing processes
(31) Engineering Optimization
(32) Product Design and Development
(33) Project/Engineering Management
(III) Mechatronics and Automation
(34) Mechatronics
(35) Industrial Robotics and Automation
(36) Intelligent control, neuro-control, fuzzy control
(37) Industrial Automation and Process Control
(38) Distributed Control System
(39) Embedded System
(40) Control system modeling and simulation techniques
(41)Enterprise Informationization and information processing technology
(42)Virtual Instrumentation
(43)Sensors, multi-sensor data fusion algorithms
(44)Advanced measurement and Machine Vision system
(45)Transmission and control of Fluid
(46)Dynamics, Vibration and Control
(IV) Engineering Education and Training
(47) Engineering education and training
(V) Other related topics
(48) Other related topics
Sponsors
The University of New South Wales, Australia
Zhejiang University, China
Xi’an Jiaotong University, China
The Hong Kong Polytechnic University, Hong Kong
Guangzhou University, China
Trans Tech Publications Inc.
Materials and Manufacturing Processes (Taylor & Francis)
Surface Engineering (Maney Publishing)
Advanced Science Letters (American Scientific Publishers)
Paper Submission
All papers must be written in English. Please prepare your paper in strict accordance with the format available at the conference website (http://www.icmmp.org). And submit your papers and the filed Paper Submission Form by email attachment to the ICMMP2011 Conference organizer (icmmpx@gmail.com) by the given deadline. All papers should be no less than 4 pages in length and shorter papers should not be included in the journal. Document file in PDF and MS Word format are both required when submitting your papers.
Important Dates (Deadline):
Submission of full Papers May 10, 2011
Notification of Papers Acceptance: June 10, 2011
Camera Ready Submission and Registration July 1, 2011
Conference November 18-20, 2011
Registration
The registration fee is 400 U.S. Dollars or 2600 RMB for each paper (over 4 pages extra-charge 50 U.S. Dollars or 300 RMB per page needs to be paid).
Only one paper can be included into the journal by paying one registration fee; you can pay Extra Paper Charges (2300 RMB or 350 U.S. Dollars) for one more paper from the same first author who already has a paid registration.
Extra-charge for Papers, which will be published in SCI-indexed journals, needs to be paid.
Contact Information
Tel: +86 20 3936 6470
Tel: +86 15817065241
School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China
