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【ICMPMIT2011】2011 International Conference on Mechanical Properties of Materials and Information Technology(EI Compendex) | |||||||||||
作者:佚名 文章来源:不详 点击数 更新时间:2011-10-23 20:14:43 文章录入:admin 责任编辑:admin | |||||||||||
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September 10~11, 2011 in Chongqing, China http://www.icss-edu.tw/icmpmit/index.htm
All ICMPMIT 2011 Accepted Papers will be published by Advanced Materials Research(ISSN:1022-
6680, TTP Publisher), which will be Indexed by Elsevier: SCOPUS www.scopus.com and Ei
Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical
Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP) www.isinet.com,
Institution of Electrical Engineers (IEE) www.iee.org, etc.
所有被ICMPMIT2011录用的文章将被AMR(ISSN:1013-9826,TTP出版社)出版,并将被EI检索(EnPapers 论文翻译、英文论文修改、SCI论文润色)。
ICMPMIT2011只接受英文投稿,初稿时可以投中文稿件,一旦录用后,必须全部翻译成英文,且文中不
能有任何中文字符(EnPapers 论文翻译、英文论文修改、SCI论文润色)。
l Submisstion system投稿系统:https://www.easychair.org/conferences/?conf=icmpmit2011 l Submission Due 截稿时间: May 25, 2011 l Paper Format: http://www.icss-edu.tw/icmpmit/NEW_AuthorInstructions.rtf l Contact: ICMPMIT2011@163.com
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